ShenZhen DB Technology.,Ltd

PCB(10)

ShenZhen DB Technology.,Ltd

Showing 1 - 10 of 20, total 2 pages [First] [Previous] [Next] [Last]

p***1
Specification: PCB-131
Detail: PCB Technical discription: layer:10 material£ºFR4 TG170 Board thickness: 1.0mm Surface finish£ºimmersion gold +gold finger Min through hole£º0.075mm(3mil) Min line width£º0.075mm(3mil) Min line ***ce£º0.075mm(3mil) ...

pcba-117
Specification: PCBA-117
Detail: PCBA Technical discription: SMT+DIP minimum ***ce size: 0.5mm ROHS complaint No. of IC: 9pcs Soldering components:196pcs Minimum component size:0603 Product use:control panel

pcba-116
Specification: PCBA-116
Detail: PCBA Technical discription: SMT+DIP minimum ***ce size: 0.5mm ROHS complaint No. of IC: 19pcs Soldering components:152pcs Minimum component size:0603 Product use:control panel Special requirements:BGA

pcba-115
Specification: PCBA-115
Detail: PCBA Technical discription: SMT+DIP minimum ***ce size: 0.5mm ROHS complaint No. of IC: 6pcs Soldering components:118pcs Minimum component size:0603 Product use:control panel Special requirements:BGA

pcba-114
Specification: PCBA-114
Detail: PCBA Technical discription: SMT+DIP minimum ***ce size: 0.5mm ROHS complaint No. of IC: 16pcs Soldering components:338pcs Minimum component size:0402 Product use:control panel Special requirements:BGA

pcba-113
Specification: PCBA-113
Detail: PCBA Technical discription: SMT+DIP minimum ***ce size: 0.3mm ROHS complaint No. of IC: 12pcs Soldering components: 198pcs Minimum component size:0805 Product use:control panel Special requirements:

pcba-112
Specification: PCBA-112
Detail: PCBA Technical discription: SMT+DIP minimum ***ce size: 0.3mm ROHS complaint No. of IC: 23pcs Soldering components: 156pcs Minimum component size:0805 Product use:control panel Special requirements:

pcba-111
Specification: PCBA-111
Detail: PCBA Technical discription: SMT+DIP minimum ***ce size: 0.5mm ROHS complaint No. of IC: 33pcs Soldering components: 1766pcs Minimum component size:0402 Product use:control panel Special requirements:BGA

pcba-110
Specification: PCBA-110
Detail: PCBA Technical discription: SMT+DIP minimum ***ce size: 0.8mm ROHS complaint No. of IC: 6pcs Soldering components: 86pcs Minimum component size:0603 Product use:control panel Special requirements:

pcba-109
Specification: PCBA-109
Detail: PCBA Technical discription: SMT+DIP minimum ***ce size: 0.5mm ROHS complaint No. of IC: 33pcs Soldering components: 1966pcs Minimum component size:0402 Product use:control panel Special requirements:BGA


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